CMC02 2006-11-06 1 toshiba rectifier silicon diffused type CMC02 for strobe discharge circuit ? repetitive peak reverse voltage: v rrm = 400 v ? average forward current: i f (av) = 1.0 a ? low forward voltage: v fm = 1.0 v (max.) ? repetitive peak forward current: i frm = 150 a (note 2) ? small surface-mount package, the ?m ? flat tm ? (toshiba package name) absolute maximum ratings (ta = 25c) characteristic symbol rating unit repetitive peak reverse voltage v rrm 400 v average forward current i f (av) 1.0 (note 1) a peak one-cycle surge forward current (non-repetitive) i fsm 30 (50 hz) a repetitive peak forward current (note 2) i frm 150 a junction temperature t j ?40~150 c storage temperature range t stg ?40~150 c note 1: ta 92c device mounted on a ceramic board board size: 50 mm 50 mm soldering land: 2 mm 2 mm board thickness: 0.64t note 3: using continuously under h eavy loads (e.g. the application of high temperature/current/voltage and t he significant change in temperature, etc.) may cause this product to decrease in the reliability significantly ev en if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/derating concept and methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). electrical characteristics (ta = 25c) characteristic symbol test condition min typ. max unit peak forward voltage v fm (1) i fm = 1.0 a (pulse test) ? 0.88 1.0 v peak repetitive reverse current i rrm v rrm = 400 v (pulse test) ? ? 10 a device mounted on a ceramic board (board size: 50 mm 50 mm) (soldering land: 2 mm 2 mm) (board thickness: 0.64 t) ? ? 60 device mounted on a glass-epoxy board (board size: 50 mm 50 mm) (soldering land: 6 mm 6 mm) (board thickness: 1.6 t) ? ? 110 thermal resistance (junction to ambient) r th (j-a) device mounted on a glass-epoxy board (board size: 50 mm 50 mm) (soldering land: 2.1 mm 1.4 mm) (board thickness: 1.6 t) ? ? 180 c/w thermal resistance (junction to lead) r th (j- ? ) ? ? ? 16 c/w unit: mm jedec D jeita D toshiba 3-4e1a weight: 0.023 g (typ.)
CMC02 2006-11-06 2 note 2: repetitive peak forward current waveform marking type code product no. c2 CMC02 standard soldering pad 3.0 1.4 2.1 unit: mm 1.4 = 1ms 1 p ulse/ 3 s ( 7000 c y cle ) i frm = 150 a ( c m = 500 f ) i frm 0.368 i frm 0 t
CMC02 2006-11-06 3 handling precautions the absolute maximum ratings denote the absolute maximu m ratings, which are rated values and must not be exceeded during operation, even for an instant. the following are the general derating methods we recommend for designing a circuit using this device. v rrm : we recommend that the worst case voltage, including surge voltage, be no greater than 80% of the absolute maximum rating of v rrm for a dc circuit, and no greater than 50% of that of v rrm for an ac circuit. v rrm has a temperature coefficient of 0.1%/ . be sure to take this temperature coefficient into account when designing a device fo r use at low temperature. i f (av): we recommend that the worst case current be no greater than 80% of the absolute maximum rating of i f (av). carry out sufficient heat design. if it is not possible to design a circu it with excellent heat radiation, set a margin by using an allowable tamax- i f (av) curve. this rating applies only to a strobe flash circuit. we recommend that the worst case current be kept within the absolute maximum rating of i frm . the total number of repetitive curre nts should not exceed 7000 within the lifespan of the device. this rating specifies the non-repetitive peak current in one cycle of a 50 hz sine wave, condition angle 180. therefore the rating applies only to abnormal operation, which seldom occu rs during the lifespan of a device. for this device, we recommend a tj of below 120 under the worst load and heat radiation conditions. thermal resistance between junction and ambient fluctuat es depending on the mounting condition of the device. when using the device, be sure to design the circuit boar d and soldering land size to match the appropriate thermal resistance value. refer to the rectifier databook for further information.
CMC02 2006-11-06 4 average forward current i f (av) (a) ta m a x ? i f (av) device mounted on a glass-epoxy board (board size:50 mm x 50 mm, soldering land 6 mm x 6 mm) maximum allowable ambient temperature ta m a x ( c ) average forward current i f (av) (a) p f (av) ? i f (av) average forward power dissipation p f (av) (w) 0 0 0.4 1.0 0.2 0.4 0.6 0.8 1.0 1.2 0.2 0.6 0.8 160 60 0 20 40 80 100 120 140 instantaneous forward voltage v f (v) i f ? v f instantaneous forward current i f (a) 0 0.01 1 100 0.4 0.8 1.6 150c t j = 25c 75c 2.0 0.1 10 1.2 0.2 0 0.4 0.6 1.0 0.8 1.2 pulse test 0.001 1000 10 ta = 25c f = 50 hz time t (s) r th (j-a) ? t transient thermal impedance r th (j-a) (c/w) peak surge forward current i fsm (a) number of cycles surge forward current (non-repetitive) 1 0 10 100 30 10 40 average forward current i f (av) (a) ta m a x ? i f (av) device mounted on a ceramic board (board size: 50 mm x 50 mm, soldering land 2 mm x 2 mm) maximum allowable ambient temperature ta m a x ( c ) 0.2 0 0.4 0.6 1.0 0.8 1.2 160 60 0 20 40 80 100 120 140 0.1 100 1000 10 0.01 0.1 1 100 1.2 conduction angle 180 0 180 halfsine waveform 20 1 conduction angle 180 0 180 halfsine waveform conduction angle 180 0 180 halfsine waveform device mounted on a glass-epoxy board: board size: 50 mm 50 mm, soldering land: 2.1 mm 1.4 mm, board thickness: 1.6 t device mounted on a glass-epoxy board: board size: 50 mm 50 mm, soldering land: 6.0 mm 6.0 mm, board thickness: 1.6 t device mounted on a ceramic board: board size: 50 mm 50 mm, soldering land: 2.0 mm 2.0 mm, board thickness: 0.64 t
CMC02 2006-11-06 5 restrictions on product use 20070701-en ? the information contained herein is subject to change without notice. ? toshiba is continually working to improve the quality and reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity an d vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba produc ts, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshib a products specifications. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconduct or devices,? or ?toshiba semiconductor reliability handbook? etc. ? the toshiba products listed in this document are in tended for usage in general electronics applications (computer, personal equipment, office equipment, measuri ng equipment, industrial robotics, domestic appliances, etc.).these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfuncti on or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage incl ude atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, et c.. unintended usage of toshiba products listed in his document shall be made at the customer?s own risk. ? the products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. ? the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba for any infringement s of patents or other rights of the third parties which may result from its use. no license is granted by implic ation or otherwise under any patents or other rights of toshiba or the third parties. ? please contact your sales representative for product- by-product details in this document regarding rohs compatibility. please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
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